Technology advances at a tremendous speed and with it, Apple improves its devices to make them more elegant and comfortable, as well as powerful. New reports suggest that the Cupertino-based company, will integrate technology used in the motherboards of this year's iPhone X in the near future.
He explains Ming-Chi Kuo, Apple technology expert analyst, who has presented a report with interesting details on this idea. Kuo ensures that the North American company works on the development of faster and more versatile motherboards, implemented in this year 2017, in the new products of the company, including the future Macs and the new Apple Watch that are presented.
Apparently, Apple is entering into a collaboration agreement with Career with the intention of implement the advancements made for iPhone X in the next generation of MacBook, reducing the space required for the product motherboard and improving data transmission such as the use of USB 3.2.
Currently, the novel motherboards of the new iPhone are flexible plates made of glass polymers, and the final idea is that they are mounted on all or almost all of the company's products.
LCP FPCB, The name of this innovative flexible integrated Apple patented, offers a data transmission of greater stability, and more resistance to heat and humidity.
The analyst also highlights that Apple's intentions to integrating this novel solution on all Apple devices in a short period of time is a huge challengeGiven its complexity, but if it manages to implement it favorably, it would give it more than a year of advantage over its main competitors.
As we know, Apple always seeks to be at the forefront of the market, and with this new adaptation in your 2018 products, you could settle once again in the place where you have always loved to be.
