Tikniyoolajiyadda waxay ku socotaa xawaare aad u weyn oo ay la socoto, Apple waxay hagaajineysaa aaladeeda si ay uga dhigto mid qurux badan oo raaxo leh, iyo sidoo kale awood badan. Warar cusub ayaa sheegaya in shirkadda fadhigeedu yahay Cupertino, ayaa dhexgeli doona mustaqbalka dhow tiknoolajiyada loo adeegsado boodhadhka Motherboard-ka ee sannadkan iPhone X.
Sidaas ayaa sharraxaysa Ming-Chi Kuo, Khabiir ku xeel dheer cilmiga tikniyoolajiyadda Apple, oo soo bandhigay warbixin leh faahfaahinta xiisaha leh ee fikraddan. Kuo waxay hubisaa in shirkadda Waqooyiga Ameerika ay ka shaqeyso horumarinta Motherboard-yada si dhakhso leh oo badan, oo laga hirgaliyay sanadkan 2017, wax soo saarka cusub ee shirkadda, oo ay ku jiraan mustaqbalka Macs iyo Apple Watch cusub ee la soo bandhigay.
Sida muuqata, Apple waxay heshiis iskaashi la galaysa Career iyada oo ujeedadu tahay hirgelinta horumarka loo sameeyay iPhone X jiilka xiga ee MacBook, yareynta booska looga baahan yahay boodhka boodhka iyo hagaajinta gudbinta xogta sida isticmaalka USB 3.2.
Waqtigaan la joogo, Motherboard-yada cusub ee iPhone-ka cusub ayaa ah taarikada jilicsan ee ka samaysan polymerka dhalada ah, iyo fikradda ugu dambeysa waxay tahay inay ku xiran yihiin dhammaan ama ku dhowaad dhammaan alaabada shirkadda.
- LCP FPCB, Magaca tan cusub ee is-bedbeddelaysa ee is-bedbeddelka leh ee Apple ayaa leh, oo bixisa gudbinta xogta xasillooni weyn, iyo iska caabin badan kuleylka iyo qoyaanka.
Falanqeeyaha ayaa sidoo kale iftiiminaya in Apple ujeedkiisu yahay isku-darka xalka cusub ee dhammaan aaladaha Apple muddo gaaban gudahood waa caqabad weyn, marka loo eego kakanaanta ay leedahay, laakiin haddii si wanaagsan loo hirgaliyo, waxay siineysaa in ka badan hal sano faa iidada ay ka leedahay tartamayaasha ugu waaweyn.
Sida aan ognahay, Apple marwalba wuxuu raadiyaa inuu noqdo safka hore ee suuqa, iyo la qabsiga cusub ee alaabadaada 2018, waxaad ku dagi kartaa markale meesha aad waligaa jeclayd inaad joogto.
